Operation process:

Zhijiang series organosilicon gel includes two independent components, A and B. Before using silicon gel, clean and degrease the device surface with appropriate solvent. Mix the two components thoroughly in a 1:1 weight or volume ratio, taking care not to mix with air during operation. It is recommended to defoaming under a vacuum of -0.09MPa~-0.08MPa for 5-10 minutes before use. After mixing components A and B for 3 minutes, the adhesive should be sealed and stored, and used up within 10 minutes, otherwise it will slowly solidify and cause waste.

Curing conditions:

The following conditions can be used for curing: 25 ℃, 24 hours; 65 ℃, 1 hour; 100 ℃ for 30 minutes; 120 ℃ for 20 minutes; 150 ℃ for 10 minutes. For larger devices, it is necessary to extend the curing time.

Compatibility:

Do not contact plasma compounds containing N, P and S, such as sulfur, polysulfide, polysulfone or other sulfur containing materials, amine, polyurethane, amide and azide. It is also not allowed to come into contact with ionic compounds of heavy metals such as Sn, Pb, Hg, Sb, Bi, As, as well as organic compounds containing unsaturated groups such as acetylene groups, as this may cause poor curing of the adhesive. Therefore, compatibility tests between silicone rubber and the substrate should be conducted before use. Cleaning the substrate with solvents or baking at slightly higher curing temperatures can avoid this problem.

Repairability:

Zhijiang organosilicon gel can still be easily removed, repaired or modified after curing and molding. The repaired area can be resealed with new gel. Since the gel has good compatibility with itself, the repaired area will be integrated with the original material.